-
softMLTM
provides in situ optimization of the data recovery channel parameters for each head/media/zone combination. It finds the Maximum-Likelihood
(ML) solution adaptively to deliver the minimum achievable bit error
rate (BER) for each operating point of the given head/media/zone
combination. softMLTM
enables better utilization of heads
and media as well as reduced test time for qualifying each HDD during
manufacturing.
-
softECCTM
combines conventional Reed-Solomon (RS) codes with iterative decoding methods and
a
soft-output softMLTM detector to dramatically reduce the Sector Failure Rate (SFR) achieved for
a given
head/media/zone combination. It preserves all of the desirable
features of the RS codes, including prescribed burst correction and mis-correction.softECCTM
enables higher areal density or improved manufacturing yields, or
both.
-
L-LDPC:
Link_A_Media Devices’ Low Density Parity Check (LDPC) Coding
provides performance gains by replacing conventional concatenated
coding structures used in today’s HDDs with a single LDPC code. Such
architecture provides performance gain that is unprecedented since the
introduction of PRML technology almost two decades ago. Link_A_Media
Devices’ proprietary LDPC platform is developed to address the
unique requirements of the data storage application to maximize the
areal density for any given head/media combination or multi-level cell
(MLC) NAND media.
-
qSYNC
uses
maximum-likelihood estimation methods to achieve rapid and robust
synchronization of the clock within the data recovery channel to
minimize the overhead fields required. qSYNC improves the format
efficiency, which may be used to reduce the flux density and improve
SNR performance, ultimately resulting in higher manufacturing yield
and product margin.
-
IOP BusterTM
architecture enables scalability within the controller to address
various segments of SSD applications seamlessly. It enables faster
Read and Write transfers to achieve prescribed IOP requirements.
These core data recovery
technologies offer the following benefits to Storage OEMs:
□
Highest storage density in
terms of bits/cell or bits/unit area
□
Lowest cost/Gigabyte
□
Highest product
reliability
□
Highest
manufacturing yields
□
Fast in situ drive testing
during manufacturing
□
Highest data
reliability
Link_A_Media Devices offers custom SoC development and
manufacturing in leading-edge 90nm and 55nm CMOS process technologies.
A wide range of
packaging options in FPBGA and TQFP are available for the smallest
footprint and height to accommodate storage peripheral applications.
Differentiated SIP
technology is available to integrate DDR or Flash memory with the SoC
on a custom substrate within the standard packages we offer.